Semiconductor Packaging (full-time)
In the Semiconductor Packaging minor of the HAN you delve into the world of semiconductors and chip packaging such as for embedded cameras and sensors
In the Semiconductor Packaging minor you will get acquainted with the semiconductor industry and delve into the final step of chip manufacturing, the phase in which the chip is 'packaged' in its housing. This packaging is becoming more and more involved. Developments such as system-on-chip, embedded cameras, RF, sensors and Micro-ElectroMechanic Systems (MEMS) place high demands on the manufacturing process and the competencies of affected employees. Packages are becoming more complex and more customer-specific, while their serial size decreases. This module focuses on the design and manufacture of semiconductor packages and the associated assembly techniques. The module was created in collaboration with the Chip Integration Technology Centre (CITC) and its partners NXP, Nexperia, Ampleon, TU Delft and TNO.
- Semiconductors and Semiconductor Packaging Fundamentals
- Advanced Applications, Materials and Packaging Techniques
- Basic Package Simulations, Device Testing and Data Analysis
- Design Quality and Reliability, Industrialization and Economics
Block exchange course
This is a block minor. It is offered once a year as a block in the 1st semester.
Type of exchange course
This is a specialisation minor. It allows you to specialise further within your own professional profile.
In the first term you get acquainted with the semiconductor industry in general and delve into the fundamentals of semiconductor assembly, packaging and test. In the second term you design a semiconductor package assembly in a group of students and working professionals from the semiconductor industry. You turn this design into a prototype to demonstrate its working principle and feasibility. The production and testing of the prototype takes place at the Chip Integration Technology Center in Nijmegen or one of its industrial partners. In parallel you study a number of elective subjects, depending on the project’s and your personal learning needs.
After this minor you will have a deep understanding of the semiconductor back-end processing complexity; packaging, testing and quality/reliability. You will be able to communicate and cooperate as starting engineer with experts in the semiconductor industry in general and from assembly and packaging in particular. A valuable asset to make a quick start in the semiconductor industry in which assembly and packaging continues to be a major challenge.
- Working in a multidisciplinary environment
- Managing and facilitating processes
- Operating in a systematic way according to protocols and standards
- Functioning in a cross-functional team
- Communicating in English
- Analysing production capabilities, customer needs, …
- Requirements engineering
- Designing and implementing prototypes
- Analysing test and reliability data
- Optimisation of assembly, packaging an test flows
- Maintaining quality
For more information:
Tel: 06 53717839
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For popular minors a draw takes place 3 to 4 weeks after the opening, if there are at that time more subscribers than available places. For the minors with places still available applies until the closing of the subscription period: Once a minor is full, it is closed!
In addition, if the number of subscribers after three weeks is below the norm; this minor may possibly be withdrawn. So if you are interested, sign up immediately!
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Note: For HAN students it means that, in case of cancellation of the first choice AFTER the period of decision (this takes about three weeks) they may re-subscribe for the still available minors.
Even then: Once a minor is full, it is closed!
- Professionals working or interested in the semiconductor industry, that want to extend or deepen their knowledge of semiconductor assembly and packaging.
- Bachelor students Electrical and Electronic Engineering, Applied Physics, Mechanical Engineering, Automotive Engineering, or Industrial Engineering & Management, who want to broaden their horizon into the field of semiconductor assembly and packaging.
Bachelor students must have completed two main modules for Electrical and Electronic Engineering, Applied Physics, Mechanical Engineering, Automotive Engineering, or Industrial Engineering & Management.
Work professionals must have bachelor level work and thinking level, and be employed or interested in the semiconductor industry.
Knowledge and fluency of the English language at B2 level is mandatory
International students must first send in their application. Based on this information it will be decided whether a student is allowed into the minor. There can be a request for further information, or for an intake assessment, to determine whether the required entry level for this minor is met.
Nice to know
- The Semiconductor Packaging minor is developed in close cooperation with, and will take place at the Chip Integration Technology Center on the Novio Tech Campus in Nijmegen and its industrial partners NXP Semiconductors, Ampleon and Nexperia.
- Offered only in the 1st semester of the year (Sep-Jan)
- At the end of the first term:
- All: Individual written integral test on lectures and practica
- FT only: Individual, criterion-oriented interview with feed-back processing on learning assignment and reporting
- At the end of the second term:
- All: A group demonstration and presentation with criterion-oriented interview and feedback processing in which you present the project and your individual contribution. In the presentation you:
- Explain your design choices;
- Demonstrate the prototype;
- Evaluate the tests;
- Substantiate the technical and commercial feasibility;
- Show how your personalized leaning supported the project.
- Lectures and practica
- Guest lectures and company visits
- Team project assignments
The module consists of 2 terms of about 9 weeks. In the first term there will be lectures, practica and company visits spanning the afternoon and evening of one day in the week, fixed but still to be determined, for both part-time and full-time students. This will be supported and supplemented via digital learning. This part of the first term program will be concluded by an individual written test.
Full-time students will also be required to participate in a generic semiconductor industry orientation program, with individual learning assignment, at the participating companies. This will take about two days a week and must be concluded by a portfolio report. The individual learning assignment and report are subject to an individual, criterion-oriented interview with feedback processing at the end of the first term.
In the second term you will work on an industrial assignment/project during two days a week at CITC nijmegen, or one of its partners, in a team of students and semiconductor professionals. In parallel you study a number of elective subjects, mostly by autonomous study of in-depth material presented in a digital learning environment. The minor is concluded by a group presentation with criterion-oriented interview and feedback processing, in which you present the project and your individual contribution and learnings.