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Semiconductor Packaging (part-time)

In the Semiconductor Packaging minor of the HAN you delve into the world of semiconductors and chip packaging such as for embedded cameras and sensors

In the Semiconductor Packaging minor you will get acquainted with the semiconductor industry and delve into the final step of chip manufacturing, the phase in which the chip is 'packaged' in its housing. This packaging is becoming more and more complex. Developments such as system-on-chip, embedded cameras, 5G, sensors and Micro-ElectroMechanic Systems (MEMS) place high demands on the manufacturing process and the competencies of affected employees. Packages are becoming more complicated and application specific, while costs must be kept low. This module focuses on the design and manufacture of semiconductor packages and the associated assembly techniques. The module was created in collaboration with the Chip Integration Technology Center (CITC) and its partners NXP, Nexperia, Ampleon, TU Delft and TNO.

  • Semiconductors and Semiconductor Packaging Fundamentals
  • Advanced Applications, Materials and Packaging Techniques
  • Basic Package Simulations, Device Testing and Data Analysis
  • Design Quality and Reliability, Industrialization and Economics

Block exchange course

This is a block minor. It is offered once a year as a block in the 1st semester.

Type of exchange course

This is a differentiation exchange course. This means it enables you to develop your professional competences in a different/broader context.

Leerdoelen

Learning outcomes 

In the first term you get acquainted with the semiconductor industry in general and delve into the fundamentals of semiconductor assembly, packaging and test. In the second term you tackle a challenging semiconductor packaging problem in a group of students and working professionals. You also turn the design into a prototype to demonstrate its working principle and feasibility. The production and testing of the prototype takes place in the laboratory of CITC in Nijmegen or at one of the industrial partners. In parallel you study a number of selective subjects, depending on the project and your personal learning needs. After this minor you will have a deep understanding of the semiconductor back-end processing complexity; packaging, testing and quality/reliability. You will be able to communicate and cooperate as starting engineer with experts in the semiconductor industry in general and from assembly and packaging in particular. A valuable asset to make a quick start in the semiconductor industry in which assembly and packaging continues to be a major challenge.

Competences

General competencies

  • Working in a multidisciplinary environment
  • Managing and facilitating processes
  • Operating in a systematic way according to protocols and standards
  • Functioning in a cross-functional team
  • Communicating in English
  • Analyzing production capabilities, customer needs, …

Technical competencies

  • Requirements engineering
  • Designing and implementing prototypes
  • Analyzing test and reliability data
  • Optimization of assembly, packaging and test flows
  • Maintaining quality

Ingangseisen

Admission requirements

  • Professionals working or interested in the semiconductor industry, that want to extend or deepen their knowledge of semiconductor assembly and packaging.
  • Bachelor students Electrical and Electronic Engineering, Applied Physics, Mechanical Engineering, Automotive Engineering, or Industrial Engineering & Management, who want to broaden their horizon into the field of semiconductor assembly and packaging. 

Bachelor students must have completed two main modules for Electrical and Electronic Engineering, Applied Physics, Mechanical Engineering, Automotive Engineering, or Industrial Engineering & Management.

Work professionals must have bachelor level work and thinking level, and be employed or interested in the semiconductor industry. 

Knowledge and fluency of the English language at B2 level is mandatory

International students must first send in their application. Based on this information it will be decided whether a student is allowed into the minor. There can be a request for further information, or for an intake assessment, to determine whether the required entry level for this minor is met.

Nice to know

  • The Semiconductor Packaging minor is developed in close cooperation with Chip Integration Technology Center and its industrial partners NXP Semiconductors, Ampleon and Nexperia.
  • It will take place at the Novio Tech Campus in Nijmegen.
  • Offered only in the 1st semester of the year (Sep-Jan). 

Rooster

Schedule

The module consists of 2 terms of about 9 weeks. In the first term there will be lectures, practical lessons and company visits spanning the afternoon and evening of one day, fixed in the week but still to be determined, for both part-time and full-time students. This will be supported and supplemented via digital learning. This part of the first term program will be concluded by an individual  written test.

In the second term you will work on an industrial assignment/project during two days a week at CITC Nijmegen, or one of its partners, in a team of students and semiconductor professionals. In parallel you study a number of elective subjects, mostly by autonomous study of in-depth material presented in a digital learning environment. The minor is concluded by a group presentation with criterion-oriented interview and feedback processing, in which you present the project and your individual contribution and learnings.

Toetsing

Working methods

  • Lectures and practical lessons 
  • Guest lectures and company visits
  • Team project assignments

Assessment

At the end of the first term:

  • Individual written integral test on lectures and practical lessons

At the end of the second term:

  • A group demonstration and presentation with criterion-oriented interview and feedback processing in which you present the project and your individual contribution. In the presentation you:
  • Explain your design choices;
  • Demonstrate the prototype;
  • Evaluate the tests;
  • Substantiate the technical and commercial feasibility;
  • Show how your personalized leaning supported the project.

Aanvullende informatie

For more information:

info@han.nl | T 31 (0)24 35 30 500 from 09.00 to 17.00 | www.han.nl

Or:

Joop Bruines
E-mail: joop.bruines@han.nl
Tel: 06 53717839

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