In the Semiconductor Packaging minor of the HAN you dive into the fascinating world of chip packaging such as for (electrical) vehicles, embedded antennas, integrated optics and sensors.

In the Semiconductor Packaging minor you will get acquainted with the semiconductor industry and focus on the final step of chip manufacturing, the phase in which the chip is 'packaged' in its housing. Packaging is becoming more and more complex. Developments such as System-on-Chip, antennas for 5G, MEMS sensors, electrical vehicles, and integrated optics place high demands on the manufacturing process and competencies of engineers. The packages are getting very complicated and application specific, while costs must be kept low. This minor focuses on the development and manufacture of semiconductor packages and the associated assembly techniques, and was created in collaboration with the Chip Integration Technology Center (CITC) and its partners NXP, Nexperia, Ampleon, TU Delft and TNO.

• Semiconductors and Semiconductor Packaging Fundamentals
• Advanced Applications, Materials and Packaging Techniques
• Basic Package Simulations, Device Testing and Data Analysis
• Package Quality and Reliability, Smart Manufacturing

Block exchange course

This is a block minor. It is offered once a year as a block in the 1st semester.

Type of exchange course

This is a differentiation exchange course. This means it enables you to develop your professional competences in a different/broader context.

Learning outcomes 

In the first term you get to know the semiconductor industry in general and dive into the fundamentals of semiconductor assembly, packaging and test. In the second term you tackle a challenging semiconductor packaging problem in a team of students. You may also be able to turn the design into a prototype to demonstrate its working principle and feasibility. The production and testing of the prototype takes place in the laboratory of CITC in Nijmegen or at one of the industrial partners. In parallel you study a number of selective subjects, depending on the project and your personal learning needs. After this minor you will have a deep understanding of the semiconductor back-end processing complexity; packaging, testing and quality/reliability. You will be able to communicate and cooperate as junior engineer with experts in the semiconductor industry in general and from assembly and packaging in particular. A valuable asset to make a quick start in the semiconductor industry in which assembly and packaging continues to be a major challenge.

Competences

General competencies

• Working in a multidisciplinary environment
• Managing and facilitating processes
• Operating in a systematic way according to protocols and standards
• Functioning in a cross-functional team
• Communicating in English
• Analyzing production capabilities, customer needs, …

Technical competencies

• Requirements engineering
• Designing and implementing prototypes
• Analyzing test and reliability data
• Optimization of assembly, packaging and test flows
• Maintaining quality

Admission requirements

• Professionals working or interested in the semiconductor industry, that want to extend or deepen their knowledge of semiconductor assembly and packaging.
• Bachelor students Electrical and Electronic Engineering, Applied Physics, Mechanical Engineering, Automotive Engineering, or Industrial Engineering & Management, who want to broaden their horizon into the field of semiconductor assembly and packaging. 

Bachelor students must have completed two main modules for Electrical and Electronic Engineering, Applied Physics, Mechanical Engineering, Automotive Engineering, or Industrial Engineering & Management.

Professionals must have bachelor level work and thinking level, and be employed or interested in the semiconductor industry. 

Knowledge and fluency of the English language at B2 level is mandatory

International students must first send in their application. Based on this information it will be decided whether a student is allowed into the minor.

The part-time program implicitly assumes basic knowledge of the semiconductor industry and the possibility to perform practical assignments at work. There can be a request for further information, or for an intake assessment, to determine if the entry conditions for this minor are met.

Nice to know

• The Semiconductor Packaging minor is developed in close cooperation with Chip Integration Technology Center and its industrial partners NXP Semiconductors, Ampleon and Nexperia.
• It will mostly take place at the Novio Tech Campus in Nijmegen.
• Offered only in the 1st semester of the year (Sep-Jan). 

Schedule

The module consists of 2 terms of about 9 weeks. In the first term there will be lectures and practical lessons spanning two half-day sessions, fixed in the week but still to be determined, for both part-time and full-time participants. This will be supported and supplemented by digital learning and weekly tasks. The first term program is concluded by an individual written test and a criterion-oriented interview with feedback processing.

In the second term you will work on an industrial assignment/project during two days a week at CITC Nijmegen, one of its partners or at your own work, if possible in a team of students. In parallel you study a number of selective subjects, mostly by autonomous study of in-depth material presented in a digital learning environment. The minor is concluded by a presentation with criterion-oriented interview with feedback processing, in which you present the project and your contribution and learnings.

Working methods

• Lectures, practical lessons and tasks 
• Guest presentations
• Project assignments

Assessment

At the end of the first term:

• Individual written test on lectures and practical lessons.

At the end of the second term:

• Demonstration and presentation with criterion-oriented interview and feedback processing in which you present the project and your contribution. In the presentation you:
• Explain your design choices;
• Demonstrate the prototype;
• Evaluate the tests;
• Substantiate the technical and commercial feasibility;
• Show how your personalized leaning supported the project.

For content information:
Joop Bruines
E-mail: joop.bruines@han.nl
Tel: 0653717839

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- For minors starting in September, after the registration period in March, a draw takes place in April if there are at that time more subscribers than available places.
- For minors starting in February, after the registration period in October, a draw takes place in November if there are at that time more subscribers than available places.

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